Standard process is RoHS compliant.
Pick and place components from 01005 through BGA-s and connectors up to 56x56x15 mm.
Reflow process is either traditional hot-air or vapor-phase for thermally complex assemblies.
| Maximum board size | 443 x 508 mm |
| Minimum board size | 70 x 50 mm |
| Maximum component size | 56 x 56 x 15 mm |
| Minimum component size | 0.4 x 0.2 mm (01005 chip) |
| Solder paste | SAC305, no-clean flux |
| Stencil | Alpha Tetra foil 558 x 558 mm (22" x 22") Mesh-mounted in 736 x 736 mm (29" x 29") frame |
